| 表面活性剂对陶瓷基底化学镀镍的作用机理及镀层性能的影响 |
| Effects of Surfactants on Electroless Ni-P Plating on Al2O3 Ceramic and Properties of Coatings |
|
| 摘要: 采用酸性化学镀技术在Al2O3陶瓷片表面沉积Ni-P镀层，通过电感耦合等离子体发射光谱，X射线衍射光谱和扫描电子显微镜等分析测试，对镀层的成分、物相和形貌进行了表征，考察了表面活性剂种类、掺量等因素对镀层表面性貌和性能的影响。结果表明,当添加5 mg·L-1 SDS时，镀速从14 μm·h-1增加到17 μm·h-1，随表面活性剂添加量继续增加，镀速呈减少趋势。添加表面活性剂能够不同程度的消除化学镀Ni-P镀层固有的胞状组织，提高表面致密性和平整性；镀层自腐蚀电流密度从43 μA·cm-2减小至3.5 μA·cm-2，镀层的耐腐蚀性能显著提高。根据电化学理论和实验规律，探讨了表面活性剂在化学镀镍磷合金反应过程的影响机理。 |
| 关键词: 化学镀 表面活性剂 陶瓷基底 表面形貌 胞状组织 |
| 基金项目: |
| Abstract: N-P coatings were deposited on Al2O3 ceramic by electroless plating and characterized by XRD, SEM and induced coupled plasma (ICP-OES). The effects of three surfactants in the electroless plating such as CTAB(Cetyl Trimethyl Ammonium Bromide), SDS(Sodium Dodecyl Sulfonate) and Tween-20 were investigated. The results show that the deposition rate of the coatings increases with a small amount of surfactants whereas it decreased with more surfactants. And the concentration of phosphor in the coatings decreases with the addition of surfactants. The addition of 5 mg·L-1 of CTAB eliminates the cell structure of traditional Ni-P coatings and improves the uniformity of the coatings. And the Icorr of the coatings decreased from 43 μA·cm-2 to 3.5 μA·cm-2 which indicated a better anticorrosion property. Based on the investigation of the experimental parameters，the effects of surfactants in the reaction process of electroless plating Ni-P coatings were analyzed according to the electrochemistry theory. |
| Keywords: electroless plating surfactants Al2O3 ceramic surface morphology cell structure |
| |
| 摘要点击次数: 1741 |
| 全文下载次数: 2839 |
| 周凤玲,李效民,高相东.表面活性剂对陶瓷基底化学镀镍的作用机理及镀层性能的影响[J].无机化学学报,2009,25(9):1584-1589. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| Support information: |
|
|
|
|
|
|
