| 包覆型纳米铜-银双金属粉研究 |
| Study on Ag coating Cu Nano Bimetallic Powders |
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| 摘要: |
| 关键词: 铜烂版废液 化学镀 铜-银双金属粉 包覆结构 |
| 基金项目: |
| Abstract: The resource comes from waste cupric liquor produced in the process of manufacturing printed circuit board(PCB). In the liquid phase, we get high pureness and excellent property nano-Cu with the hydrazine dydrate as the reducer and the PVP and OP-10 as the dispersant. After the nano-Cu is sensitized and acted, the nano Cu-Ag Bimetallic Powders are got through 5% PVP and OP-10 are went into the plating solution and they are chemic plating. It is stated by the experimentation result that the powders can substitute Ag as the padding of conduction coating or shield coating. |
| Keywords: coppery waste liquid chemically plating Cu-Ag bimetallic powders full-package structure |
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| 廖辉伟,李 翔,彭汝芳,王兴明.包覆型纳米铜-银双金属粉研究[J].无机化学学报,2003,19(12):1327-1330. |
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