| 电子能谱法研究锡铅合金镀层的表面状态及其与可焊性的关系 |
| AES/XPS STUDY OF OXIDES FILM ON ELECTROPLATED Sn-Pb ALLOY AND ITS RELATIONSHIP WITH SOLDERABILITY |
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| 摘要: 本文用X射线光电子能谱(XPS)和俄歇电子能谱(AES)研究了Sn-Pb合金镀层的表面氧化物膜状态并用润湿称量法测定了可焊性。结果表明,Sn-Pb合金镀层表面生成的氧化物膜主要由四价锡的氧化物(SnO2·XH2O和SnO2)组成,铅的氧化物只占很少部分。这说明Sn-Pb合金镀层中锡组分较铅容易氧化。 Sn-Pb合金镀层经155℃加热16小时后,表面氧化物膜的厚度增长很大,同时可焊性明显下降。当Sn-Pb合金镀层经过热熔后,表面变得致密光亮;经155℃加热16小时后生成氧化物膜的厚度较未经热熔的在相同条件下要薄。同时可焊性也较未热熔的好。这说明Sn-Pb合金表面生成氧化物膜的厚度是影响可焊性的重要因素,热熔使Sn-Pb镀层均匀的再结晶改变了镀层结构,使之成为致密的细晶结构,增加了镀层表面的抗氧化能力。故经热熔处理的Sn-Pb合金镀层具有较长的贮存期仍能保持良好的可焊性。 |
| 关键词: 合金表面氧化膜 用俄歇和X射线光电子能谱的表面分析 |
| 基金项目: 中国科学院自然科学基金会 |
| Abstract: X-ray photoelectron spectroscopy (XPS) and Auger electron spectro-scopy (AFS) were used to study the oxides film on electroplated Sn-Pb alloys. The corresponding solderability testings of these Sn-Pb electroplates were determined by wetting balance method.The results show that the oxides film formed on the surface of electroplated Sn-Pb alloy is predominantly constituted of stannic oxide (SnO2·XH2O and SnO2). The oxide of lead is only a little portion. This means that on the electroplated Sn-Pb alloy the component of tin is more readily oxidized than lead. After the Sn-Pb electroplate heat aged for 16 h at a temperature of 155℃, the thickness of oxides film thus formed was large increase and solderability obviously dropped down.When the Sn-Pb electroplate was treated by solder fusing process, the surface appearence became brightness and after heat aged for 16 h at 155℃, the thickness of oxides film thus formed was thiner than non-fused Sn-Pb electroplate aged in same condition. The solderability was also better than the non-fused Sn-Pb electroplate. This means the thickness of oxides film formed on electroplated Sn-Pb alloy is an important factor which influences the solderability. Solder fusing process can exchange the issue of Sn-Pb electroplate to a homogeneous recrystallized alloy exhibiting a fine grain structure and thus increases the anti-oxidiziag ability. So that the fused Sn-Pb electroplates have far superior shelf life. |
| Keywords: surface oxide film of Sn-Pb surface analysis by AES and XPS |
| 投稿时间：1986-03-01 |
| 摘要点击次数: 2296 |
| 全文下载次数: 1836 |
| 庄瑞舫,徐问文.电子能谱法研究锡铅合金镀层的表面状态及其与可焊性的关系[J].无机化学学报,1986,2(3):10-22. |
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